The first picture shows the rear end/chase side of the process. In this corridor you will expect to see the rear of the machine and where the mechanical and electrical services are connected to the equipment.
The second picture depicts the front business end of a silicon Wafer furnace.
The silicon wafers are loaded into quartz boats in turn loaded onto rails.
This process can either be thermal oxidation, diffusion or RTA (Rapid thermal annealing).
Machines and Equipment being positioned in the photolithography area in a Class 100 Clean Room under the Federal Standard 209E. Notice the raised floor where this design allows full laminar flow of air from above, passing over people and equipment through the perforated floor where it returns to the plenum above to be filtered through HEPA (High Efficiency Particulate Arresters) filter system.